The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 1998
Filed:
Aug. 05, 1996
Applicant:
Inventors:
Akira Ohtani, Shiga-ken, JP;
Kunihiko Hamada, Takefu, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B / ; H01B / ;
U.S. Cl.
CPC ...
252514 ; 252512 ; 427 61 ;
Abstract
Disclosed is an electroconductive paste and a laminated ceramic electronic part produced by the use of the paste. The part exhibits improved heat-shock resistance during surface mounting thereof. The paste comprises a metal component and glass frit dispersed in an organic vehicle, and the glass frit comprises a zinc borosilicate containing CaO. The proportion of CaO to the total weight of the glass frit is preferably about 3 to 15 wt. %. The laminated ceramic electronic part comprises outer electrodes formed on the sides of the body of the part by baking the paste thereon.