The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 1998

Filed:

Aug. 20, 1996
Applicant:
Inventors:

Kazuhiro Tokunaga, Kanagawa-ken, JP;

Takashi Tsubosaki, Kanagawa-ken, JP;

Shoichi Itoh, Kanagawa-ken, JP;

Hisashi Yamada, Kanagawa-ken, JP;

Assignee:

Kasai Kogyo Co., Ltd., Kanagawa-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
156285 ; 156311 ; 156322 ; 264511 ;
Abstract

In a method and molding apparatus for laminated molded bodies, a thermal-molding felt and a thermoplastic resin sheet, respectively in hot and soft condition, are set or placed on a mold face of a cold-pressing-molding lower mold. A cold-pressing-molding upper mold lowers onto the lower mold to press the thermal-molding felt and the thermoplastic resin sheet. Simultaneously, cooling air is supplied to center portion of the thermal-molding felt through a blowing pipe protruding from mold face of the thermal-molding felt side and intruding into the felt accelerating circulation of cooling air and cooling of the thermoplastic resin sheet.


Find Patent Forward Citations

Loading…