The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 1998
Filed:
Sep. 12, 1997
Kabushiki Kaisha Toshiba, Kanagawa-ken, JP;
Abstract
A bump of an electrically conductive metal protrudes from an electrode pad of a junction FPC. The bump includes a lead portion that penetrates a conductor pattern and a base layer of the junction FPC and projects on the back side of the base layer. A spare solder layer is formed on the surface of the bump. In soldering the electrode pad of the junction FPC to a connecting pad of a main FPC, the bump and the connecting pad are opposed to each other, and a heat source is pressed against the lead portion of the bump from the side of the base layer of the junction FPC. Heat is transmitted to the spare solder layer through the lead portion and the bump, whereupon the spare solder layer is melted for soldering.