The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 1998

Filed:

Apr. 19, 1995
Applicant:
Inventors:

Yuzo Shimada, Tokyo, JP;

Takayuki Suyama, Tokyo, JP;

Yoshimasa Tanaka, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257718 ; 257706 ; 257720 ; 257712 ; 361709 ; 361711 ; 361720 ;
Abstract

An electronic package includes a supporting member, an electronic device, a carrier, a substrate a cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling is attached onto and supported by the upper surface of the plate.


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