The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 1998
Filed:
Nov. 18, 1996
Jin Sung Kim, Cheongju, KR;
LG Semicon Co., Ltd., Cheongju, KR;
Abstract
A semiconductor package of the present invention is light, thin, simple and small, and can have more than 500 pins. The package includes a substrate having a cavity and a plurality of internal leads to serve as an electrical path. A plurality of internal terminals is formed on the bottom of the cavity and is connected to one end of the internal leads. A plurality of external terminals is formed on the bottom surface of the substrate and is connected to the other ends of the internal leads. A conductive adhesive formed on the upper surfaces of the internal terminals, and a semiconductor chip with chip pads is bonded to the upper surfaces of the conductive adhesives. A molded body is formed in the cavity such that the semiconductor chip is surrounded or partially covered. At least one semiconductor chip can be mounted in the cavity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile