The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 1998
Filed:
Aug. 27, 1997
Applicant:
Inventors:
Atul Goel, Fort Collins, CO (US);
Yaw-Hwang Chen, Fort Collins, CO (US);
John R Spencer, Loveland, CO (US);
Assignee:
Hewlett-Packard Company, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257 48 ; 257503 ; 257673 ; 257700 ; 257758 ; 257778 ; 257781 ; 438406 ; 438453 ; 438593 ; 438622 ;
Abstract
An integrated circuit device is provided that has I/O bonding pads across the surface of the chip, where the I/O bonding pads can be electrically accessed via ancillary testing pads in order to perform functionality or other necessary tests prior to bump bonding formation without damaging the bonding pads or the underlying circuitry.