The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 1998
Filed:
Mar. 31, 1997
Naotaka Tanaka, Ibaraki-ken, JP;
Akihiro Yaguchi, Ibaraki-ken, JP;
Makoto Kitano, Tsuchiura, JP;
Tatsuya Nagata, Ishioka, JP;
Tetsuo Kumazawa, Ibaraki-ken, JP;
Atsushi Nakamura, Fuchu, JP;
Hiromichi Suzuki, Machida, JP;
Masayoshi Tsugane, Kodaira, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.