The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 1998
Filed:
Aug. 05, 1996
Takeyoshi Doko, Tokyo, JP;
Koji Okada, Tokyo, JP;
Abstract
The present invention relates to an Al alloy solder material comprising a composition containing Si in an amount of more than 7.0 to 12.0% or less by weight, Cu in an amount of more than 0.4 to 8.0% or less by weight, Zn in an amount of more than 0.5 to 6.0% or less by weight, Mn in an amount of more than 0.05 to 1.2% or less by weight and Fe in an amount of more than 0.05 to 0.5% or less by weight, or at need, further one or both of In and Sn respectively in an amount of 0.3% or less by weight, with the remainder being Al and inevitable impurities. A brazing sheet clad with the solder material and used for various members of the heat exchanger enables satisfactory brazing at a temperature as low as 570.degree. to 580.degree. C. and is excellent in corrosion resistance. Since the brazing sheet is brazed at a low temperature, a high-strength material having a low melting point is used for a core material of a fin, a tube or the like. Thus, the reduction of a sheet thickness and that of size and weight of the Al alloy heat exchanger are realized. Since this solder material contains Mn and Cu or the like, this solder material has an advantage in being manufactured, namely recycled from scrapped Al alloy heat exchangers or scraps of brazing sheets when manufactured in a factory.