The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 1998
Filed:
Nov. 07, 1996
Applicant:
Inventor:
Hiroshi Hayai, Fujieda, JP;
Assignee:
Sumitomo Bakelite Company Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428209 ; 4283202 ; 4283215 ; 428323 ; 428413 ; 4284258 ; 428901 ; 428344 ; 1563073 ;
Abstract
A process for producing a multilayer printed circuit board, comprising the steps of: impregnating a thermosetting resin in a base material to form a prepreg, applying a thermosetting epoxy resin undercoating agent comprising dicyandiamide and a micro-capsulated imidazole compound to at least one side of an interlayer circuit board on at least one side of which circuit has been formed, heating the applied undercoating agent to dry or semi-cure the undercoating agent, and laying the prepreg on at least one side of the dried or semi-cured undercoating agent-applied interlayer circuit board and subjecting them to laminating press.