The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 1998
Filed:
Oct. 24, 1996
Applicant:
Inventor:
Hideki Ishii, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257684 ; 257666 ; 257685 ; 257686 ; 257696 ; 438124 ; 438126 ;
Abstract
A semiconductor device with reduced thickness, improved heat radiation, and a stacked structure. Molded resin covers an IC chip wire and part of a die pad. The die pad is exposed from the molded resin. An external lead in the same plane as the exposed surface of the die pad extends to a side of the resin opposite the die pad and along the molded resin. This structure allows a reduction in thickness of the semiconductor device, the exposed die pad improves heat radiation, and the external lead on upper and lower surfaces of the resin allows the semiconductor devices to be stacked.
Published as:
CN1160934A; DE19650148A1; JPH09260568A; KR970067810A; TW340257B; US5835988A; KR100229518B1; CN1099711C; DE19650148B4;