The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 1998
Filed:
Jan. 31, 1997
David C Mundinger, Livermore, CA (US);
James Z Holtz, Livermore, CA (US);
Robert E Grove, Pleasanton, CA (US);
Star Medical Technologies, Inc., Pleasanton, CA (US);
Abstract
A method of packaging laser diode arrays includes the steps of forming a submount array having a plurality of submounts and an element for maintaining a precise spacing between the submounts; bonding the submounts to a substrate formed of an electrically insulating material; removing the element maintaining the precise spacing; and placing a diode bar in each of the precise spacings between adjacent submounts. For one embodiment of the invention, the submount array is formed by providing a plurality of submounts and a removable spacer between each pair of adjacent submounts, which spacers may be fixtured and are removed after the submounts are bonded to the substrate. For a second embodiment, the submount array is formed by machining a block of material from which submounts are to be formed into a plurality of submounts joined to each other by at least one attachment structure. After the submounts have been bonded to the substrate, the attachment structures may be machined away of otherwise removed. For the second embodiment, the submount array may have additional structures which may be used for alignment, mounting or other functions and selected features, able for a variety of functions, may be formed in such additional structures or in the submounts. The additional structures are secured to the submount array by attachment structures. One or more of the additional structures may be bonded to the substrate and will remain on the substrate when the attachment structures are removed.