The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 1998
Filed:
Jul. 28, 1995
Ryo Nakano, Ohtsu, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
The present invention presents a fluid flow process analyzing apparatus and method, an injection molding process analyzing apparatus and method, an injection molded product and an injection molded product producing method, in which a three-dimensional model divided into a plurality of small elements to present a cavity where fluid flows is used for analyzing a process of fluid flow such as injection molding process in a practical computing time. The fluid flow process analyzing apparatus and method of the present invention comprises; constructing a three-dimensional model divided into a plurality of small elements to represent a cavity where fluid flows, determining the flow conductance .kappa. as a small value when the small element concerned is located close to the cavity wall surface and as a large value when the small element is located far away, and computing the pressures, pressure transitions or flow velocities at the respective small elements based on the flow conductances determined. The injection molded product producing method of the present invention determines the injection molding conditions such as product shape, mold design and material selection using the fluid flow process analyzing apparatus or method described above.