The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 1998

Filed:

Apr. 18, 1996
Applicant:
Inventor:

Hideaki Maekawa, Kawasaki, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257680 ; 257778 ; 257 81 ; 257 82 ; 257432 ; 257787 ;
Abstract

In the semiconductor of the present invention, the first pair of pad lines consisting of a plurality of pads are arranged on the bottom portion of the recess portion of the enclosure, the recess portion being made at the center portion of the enclosure by the counterboring process to have a predetermined depth. At approximately center of the recess portion, a suction opening is made so as to suck the potting material from outside. In the recess portion of the enclosure, the semiconductor chip is supported. The semiconductor chip has the second pair of pad lines arranged to oppose to the first pair of pad lines and electrically connected to the first pair of pad lines respectively. The potting material is poured into the recess portion so as to completely cover the semiconductor chip. At the same time, the potting material is sucked from the suction opening.


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