The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 1998
Filed:
Mar. 04, 1994
Siamak Jonaidi, San Jose, CA (US);
Silicon Graphics, Inc., Mountain View, CA (US);
Abstract
An apparatus for modifying a printed circuit board comprised of a nonconductively adhering flexible circuitized substrate, the flexible circuitized substrate having a conductive circuit trace composed of one or more layers of thin wires sandwiched between two or more layers of flexible insulating protective material. The wires forming the circuit trace of the flexible substrate and the conductors forming the circuitry in and on the printed circuit board are electrically interconnected at appropriate predetermined positions by establishing conductive paths through portions of the insulating layers of the flexible circuitized substrate. Circuit components can also be affixed to either the flexible circuitized substrate or to the printed circuit board or to both after the flexible circuitized substrate has been affixed to the printed circuit board. By this means, additional or corrective electrical connections can be made to the printed circuit board at one time without the danger of routing errors or unwanted transmission effects of soldered wire interconnects. Additionally, circuit components of a differing bonding-pad configuration or pitch may be conveniently substituted for those originally designed to be used within the printed circuit board circuitry.