The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 1998
Filed:
Mar. 27, 1997
Mark Freeland, Farmington Hills, MI (US);
Ford Motor Company, Dearborn, MI (US);
Abstract
There is disclosed herein an electronic circuit assembly using a bonding material/phase change material system for electronic device heat burst dissipation. One embodiment of the assembly comprises: a substrate having a substrate surface with a preselected mounting site located thereon; a predetermined amount of phase change material disposed on the substrate surface at the preselected mounting site; a predetermined amount of bonding material arranged on the substrate surface at the preselected mounting site so as to substantially surround the predetermined amount of phase change material; and an electronic device having a heatspreader portion, the device being oriented such that the heatspreader portion is positioned at the preselected mounting site over the predetermined amounts of phase change material and bonding material, the heatspreader portion being attached to the substrate surface by the bonding material.