The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 1998
Filed:
Aug. 15, 1994
Tadayuki Oda, Mie-ken, JP;
Nissen Chemitec Corporation, Ehime-ken, JP;
Abstract
A device for tucking covering materials into a formed component comprises a support mold for the formed component which supports covering materials such as textiles, on its upper face for insertion into the formed component at a ring-formed tucking groove outward from the outer periphery of the upper face. The device has a tucking mold that is positioned at the outer periphery of the support mold for the formed component, and that has a ring-formed tucking blade which is capable of tucking an edge of the covering materials into the tucking groove of the formed component supported by the support mold for the formed component. An outer support mold for an outer periphery is positioned at the outer periphery of the ring-formed tucking mold, and supports the outer periphery of the formed component supported by the support mold for the formed component. The molds are baised respectively by energizing springs so that they protrude upward to be pressed down by a pressing mold, by which a load more than that required to be applied to the tucking blade of the tucking mold is automatically prevented, thus set-up of the dimension of height is simple and arranged with ease, and moreover the covering materials are bonded and fixed effectively onto the formed component with no failure.