The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 1998
Filed:
Aug. 22, 1996
Hirohiko Fujimaki, Shizuoka, JP;
Manabu Kiuchi, Kanagawa, JP;
Tetsuya Takaai, deceased, late of Tokyo, JP;
Yazaki Corporation, Tokyo, JP;
Abstract
A manufacturing method for an alumina-dispersed reinforced copper alloy according to the invention is an improved method which is capable of manufacturing efficiently alumina-dispersed reinforced copper having both good electro-conductivity used for wire-manufacturing-material and good mechanical property, the manufacturing method comprises the steps of obtaining powders constituted by particles having aluminum-contained copper alloy-oxide, allowing to mill aluminum-contained copper alloy powder within the air atmosphere by milling device with mechanical-alloying-operation due to shock compression, converting aluminum into aluminum-oxide by heat-treatment of the powders within inert atmosphere, implementing reduction-treatment of the converted member within the reducing atmosphere, and executing hot extrusion the reduction-treated-material.