The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 1998
Filed:
Jun. 25, 1996
Yoshihisa Saeki, Saitama-ken, JP;
Kenji Hamabe, Saitama-ken, JP;
Kouzou Hayashi, Kanagawa-ken, JP;
Sachio Yokote, Kanagawa-ken, JP;
Hiromasa Marubayashi, Kanagawa-ken, JP;
Hiroyuki Toshino, Kanagawa-ken, JP;
Nobuhiro Imai, Kanagawa-ken, JP;
Masaya Akiyama, Kanagawa-ken, JP;
Mitsui Chemicals, Inc., Tokyo, JP;
Honda Giken Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
Disclosed is a resin composition for the making of automobile bumpers comprising specified amounts of (A) a specific propylene-ethylene block copolymer, (B) a specific propylene homopolymer, (C) (C1) an ethylene-propylene copolymer rubber (EPM) and/or (C2) an ethylene-propylene-diene copolymer rubber (EPDM), (D) talc, and optionally (E) a polyhydroxy polyolefin. This resin composition shows an improvement in flexural modulus of elasticity and low-temperature impact resistance and also has good processability by injection molding, especially in terms of planar smoothness. Moreover, when component (E) is added, this resin composition provides automobile bumpers having adequate coating adhesion and hence excellent paintability. Thus, this resin composition is highly suitable for use in the making of automobile bumpers.