The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 1998
Filed:
Aug. 07, 1996
Masayuki Fujimoto, Tokyo, JP;
Matsuo Nakazawa, Tokyo, JP;
Hiroshi Takahashi, Tokyo, JP;
Kazutaka Suzuki, Tokyo, JP;
Koichiro Isuzuku, Tokyo, JP;
Taiyo Yuden Co., Ltd., Tokyo, JP;
Abstract
The present invention relates to a method of manufacturing a circuit module through the use of a wireless bonding technique. In this invention, in order to achieve component assembly without experiencing thermal and mechanical stresses, in the circuit module manufacturing method in which an external electrode of a component and a conductor of a substrate are connected with each other according to the wireless bonding technique, the substrate has a laser beam transmissible property, and after the component is placed on an assembly surface of the substrate, a laser beam is applied from a surface of the substrate opposite to the assembly surface thereof to a connecting spot. The laser beam passing through the substrate heats the connecting spot so that the connection between the external electrode of the component and the conductor of the substrate is made by phase transition or diffusion.