The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 1998
Filed:
Dec. 28, 1995
Paul John Fleming, Lima, NY (US);
Eastman Kodak Company, Rochester, NY (US);
Abstract
A method for connecting selected bonding pads of a universal current driver IC supporting a maximum resolution, e.g., 600 DPI, with the appropriate bonding pads of the same or a lower resolution LED chip array. The output pads of the current driver IC and the pads of the LED elements of each LED chip array or segment are matched so that wire bonding takes place between the physically closest pads. Consequently, the universal current driver IC may be employed with LED chips or segments of a certain standardized length that contain 96 LED elements for 300 DPI, 128 LED elements for 400 DPI, and 192 LED elements for 600 DPI or the like. The selection algorithm, in picking the physically closest IC current driver pad to be connected to an LED element pad leaves certain stages of the IC driver unconnected.