The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 1998
Filed:
Apr. 17, 1997
Applicant:
Inventor:
Yoshiaki Sano, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kanagawa, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
174 524 ; 257675 ; 257676 ; 257713 ; 257707 ; 257695 ;
Abstract
A semiconductor device including an insulating package outer frame member, outer leads, positioning dummy leads, a heat radiating plate, and a semiconductor chip mounted to the heat radiating plate. The heat radiating plate is made from a different material from that of the outer leads, and the positioning dummy leads act to regulate the position of the heat radiating plate during the soldering process. The positioning dummy leads and the outer leads are made in a common lead frame, and are separated from each other after the soldering process, preferably after the subsequent plating process.