The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 1998
Filed:
Nov. 02, 1993
Richard J Balcarek, Taunton, MA (US);
Robert L Bartosh, Attleboro, MA (US);
Robert P Bishop, Pembrook, MA (US);
Bryan J Dague, North Attleboro, MA (US);
Douglas B Strott, Attleboro, MA (US);
John M Armacost, Slatersville, RI (US);
Steven Beringhause, Norton, MA (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A fluid pressure sensor particularly useful for measuring pressure up to approximately 2000 psi has a hexport (12, 112, 212, 312) formed with a stop surface (26, 326) in a bottom wall (18) circumscribing a fluid pressure inlet (16). A pressure sensing module (22) is received on the stop surface and a distal end (40) of a wall (20, 120, 320) of the hexport is crimped to lock the pressure sensing module onto the stop surface with the stop surface limiting the amount of compression of an O-ring (30) disposed contiguous to and inboard of the stop surface. In one embodiment the crimp is placed directly on a metal ring (38) attached to a plastic connector (32) which in turn transfers the crimping force to the pressure sensing module. In other embodiments (FIGS. 2, 3) the crimp is placed directly in the pressure sensing module to form a subassembly. In one embodiment, a separate sleeve (142) member connects the subassembly to the plastic connector while in another embodiment the connector is provided with an extended skirt which snaps over the hexport to connect the connector to the subassembly. In yet another embodiment, the plastic connector (332) is formed with a strengthening flange (334) received around the pressure sensing module and the crimp is formed directly on the plastic connectors to reduce contact stresses in the crimp and compensate for crimp wall springback.