The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 1998

Filed:

Oct. 27, 1995
Applicant:
Inventors:

Mutsuo Akao, Kanagawa, JP;

Osamu Suzuki, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
428 357 ; 428 368 ; 428 3692 ; 428339 ; 430347 ; 430496 ; 430501 ; 206578 ; 2063161 ; 2063162 ; 206389 ; 206455 ; 206416 ;
Abstract

An injection molded article for photographic photosensitive materials is disclosed, which is formed of a noncrystalline resin composition containing 50 wt % or more of a noncrystalline resin having a melt flow rate of from 1 to 60 g/10 min, a flexural modulus of elasticity of 20,000 kg/cm.sup.2 or more and a thermal deformation temperature of 70.degree. C. or higher, from 0.1 to 45 wt % of one or more of a rubbery material, a thermoplastic elastomer and an ethylene copolymer resin, from 0.01 to 49.9 wt % of one or more of a light-shielding material and a fibrous filler and from 0.001 to 20 wt % of one or more of an antioxidant, an age resistor, an ultraviolet absorbent, a fatty acid metal salt, a radical scavenger, a hydrate double salt compound and an oxidation inhibitory synergistic effect-providing agent. Also disclosed are a method for forming the injection molded article for photographic photosensitive materials and a package using the injection molded article for photographic photosensitive materials.


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