The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 1998
Filed:
Apr. 10, 1996
Applicant:
Inventors:
Kaoru Shimizu, Osaka, JP;
Kazuhiko Kodama, Kyoto, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264512 ; 264515 ;
Abstract
Molding methods for disposing a functional film on a hollow inner surface or undulated surface. A blow molding process for manufacturing a molded product having a hollow part and a pressure forming process for manufacturing a molded product having an undulated part, and the products produced there from. Before the parison or forming material is cooled and solidified, a compressed fluid containing a material for forming a film is supplied into a die, thereby forming a film simultaneously when molding.