The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 1998

Filed:

Apr. 23, 1997
Applicant:
Inventors:

George A Meyer, IV, Conestoga, PA (US);

Jerome E Toth, Hatboro, PA (US);

Assignee:

Thermal Corp., Georgetown, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D / ;
U.S. Cl.
CPC ...
16510433 ; 257719 ; 361700 ;
Abstract

An apparatus is a heat conducting connection between a heat pipe and a structure such as an integrated circuit heat sink. The heat sink contains a groove with extension tabs protruding above edges of the groove so that the tabs can be bent over to hold the heat pipe in the groove which is dimensioned to give a clearance space around the heat pipe. When the tabs are bent down far enough to deform the heat pipe or a heat conductive hardening material is used to fill the clearance space, the heat pipe is fixed in place. If the tabs are bent down to barely contact the heat pipe and a heat conductive non-hardening material is used to fill the clearance space, the heat pipe can still be rotated within the groove.


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