The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 1998

Filed:

Mar. 25, 1997
Applicant:
Inventor:

Victor J Adams, Tempe, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257777 ; 257666 ; 257669 ; 257778 ;
Abstract

An integrated circuit sensor assembly (10) is mounted to a solid surface (11) of a metal leadframe (12) by placing RTV adhesive (30-36) at the four corners of the substrate (14). The RTV material cover less than the entire surface area between the leadframe surface and the substrate. The RTV provides coplanar support for the sensor assembly while maintaining a gap between a significant portion of the surface area between the substrate and the leadframe surface. The metal leadframe undergoes compression and expansion stresses from temperature cycling during the manufacturing process. The gap decouples the sensor assembly from leadframe and provides stress isolation. Moreover, the flexibility and resiliency of the four corner RTV dots absorb stress induced by the leadframe.


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