The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 1998
Filed:
Sep. 13, 1996
Tetsuya Ashida, Tokyo, JP;
Touru Noda, Tokyo, JP;
Osamu Kojima, Tokyo, JP;
Tomoichi Morita, Tokyo, JP;
Nobushige Ikeya, Kurashiki, JP;
Takuya Seri, Kurashiki, JP;
Kohhei Nitta, Ishikawa, JP;
Mitsubishi Paper Mills Limited, Tokyo, JP;
Mitsubishi Chemical Corporation, Tokyo, JP;
Abstract
Disclosed are resin-coated paper having on one side of its base paper a first resin layer made of a resin composition obtained by melt-blending 90 to 65 parts by weight of a high-density polyethylene resin having a melt flow rate of 10.0 g/10 min to 40.0 g/10 min and a density of 0.960 g/cm.sup.3 or more and 10 to 35 parts by weight of a low-density polyethylene resin or a medium-density polyethylene resin, which has a melt flow rate of 0.2 g/10 min to 2 g/10 min, a density of 0.935 g/cm.sup.3 or less, a percentage of molecules with a molecular weight of 500,000 or more of 10% by weight or more and a critical shear rate of 0.5 (l/sec) or less, said resin composition obtained by the melt-blending having a critical shear rate of 10 (l/sec) or less; and a process for producing the resin-coated paper. The resin-coated paper is good in the molding processability of the resin layer, is excellent in the adhesion between the resin layer and the base paper, and contains only a small amount of a gel formed.