In-situ laser patterning of thin film layers during sequential depositing

Abstract

The present invention involves in situ laser patterning of thin-film layers during sequential deposition of the different layers. The layers may be applied using any known method of film deposition. The method of the present invention involves laser ablation to remove unwanted portions of the coating layers, including color filter materials, that have been sequentially deposited onto substantially the entire surface of a substrate. By controlling the depth of the laser ablation removal of the deposited films, it is possible to remove any portion of a film or layers of films or coatings that have been sequentially coated onto the surface of the substrate and to thereby control the depth and location of color filter materials coated upon the substrate. This patterning process can be employed in conjunction with any film deposition technique known in the art, including vacuum, wet chemical or dry processing deposition techniques, but is preferred with vacuum deposition. Because both the coating and the selective removal of the coatings by laser ablation can be performed without breaking vacuum, in the case of vacuum deposition, the process greatly simplifies and increases the rate of production of coated arrays, including color filter arrays. In addition, this method allows for the construction of complex pattern, thin film structures without the need for masking encountered with other patterning processes.