The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 1998
Filed:
Aug. 09, 1996
Applicant:
Inventor:
Naoki Nagashima, Kanagawa, JP;
Assignee:
Sony Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
4271262 ; 427344 ; 427369 ; 4274192 ; 4274196 ; 4274193 ;
Abstract
A method of planarizing films in a semiconductor device, which is capable of uniformly planarizing films at a good controllability in polished amounts while keeping uniformity in polishing within a wafer surface. The method includes the steps of forming a first film on at least a step portion provided on a base body, covering the step portion with a second film containing phosphorus in an amount of from 6 to 9 wt % and higher in polishing rate than the first film, and polishing the second film to expose the first film formed on the top of the step portion.