The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 1998

Filed:

Sep. 30, 1996
Applicant:
Inventors:

Shigeru Kadota, Hekinan, JP;

Takashi Furukawa, Nagoya, JP;

Kiyoshi Kawaguchi, Toyota, JP;

Masahiko Suzuki, Hoi-gun, JP;

Kenji Yamada, Chiryu, JP;

Assignee:

Nippondenso Co., Ltd., Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D / ;
U.S. Cl.
CPC ...
16510433 ; 257715 ; 361700 ; 361724 ;
Abstract

According to the present invention, a cooling apparatus using boiling and condensing refrigerant, includes a refrigerant tank placed in a sealed space formed in a casing, and a radiator placed in a non-sealed space in the casing. Refrigerant is sealed in the refrigerant tank. The refrigerant tank has a metal base plate joined to one wall surface of an extrusion member constituting the refrigerant tank. A base plate has a first heating element having a high heating density fastened thereto with bolts. To another wall surface of the extrusion member is joined a heat-receiving fin which transmits the heat received from the air in the sealed space to the refrigerant in the refrigerant tank and is covered with a cover which also serves as a passage for the air from a fan. In the sealed space where the refrigerant tank is placed, plural second heating elements having low heating densities are placed without being directly attached thereto. In this way, it is possible to cool at least two heating elements having different heating densities and to reduce the size of the apparatus as well as the manufacturing cost.


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