The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 1998
Filed:
Dec. 02, 1996
Tsuneo Hamaguchi, Hyogo-ken, JP;
Kenji Kagata, Hyogo-ken, JP;
Goro Izuta, Hyogo-ken, JP;
Mitsunori Ishizaki, Hyogo-ken, JP;
Osamu Hayashi, Hyogo-ken, JP;
Susumu Hoshinouchi, Hyogo-ken, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A high-speed, high-density, small-sized, low-cost semiconductor device wherein the feeder substrate 2 for supplying power to the semiconductor elements 3 as a bare chip has the containers 2a for containing the semiconductor elements 3, the semiconductor elements 3 are bonded to the wiring layer 1b of the signal transmission substrate 1 for transmitting signals to the semiconductor elements 3 and contained in the containers 2a, the containers 2a are covered with the signal transmission substrate 1, and the signal transmission substrate 1 is superposed upon and bonded to the feeder substrate 2.