The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 1998
Filed:
Aug. 28, 1997
Applicant:
Inventors:
Assignees:
Fujitsu Limited, Kawasaki, JP;
Kyushu Fujitsu Electronics Limited, Kagoshima, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257676 ; 257682 ; 257784 ; 438473 ;
Abstract
A method of manufacturing a semiconductor device which includes a semiconductor chip and a plastic package of a thermosetting polymer encapsulating the semiconductor chip through a molding process. The thermosetting polymer of the plastic package fully or partially covers a bottom surface of the semiconductor chip. An ultraviolet cleaning process is performed for cleaning the bottom surface of the semiconductor chip prior to the molding process.