The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 1998
Filed:
Nov. 06, 1995
Hitoshi Kubota, Kyoto, JP;
Masao Yamamoto, Kyoto, JP;
Komei Sudo, Kyoto, JP;
Daisuke Kitawaki, Kyoto, JP;
Takayuki Hamasaki, Kyoto, JP;
Masayoshi Akiyama, Kyoto, JP;
Hironobu Kawauchi, Kyoto, JP;
Masaru Nagano, Kyoto, JP;
Hiroshi Imai, Kyoto, JP;
Mitsunori Baba, Kyoto, JP;
Masaru Shoji, Kyoto, JP;
Hiroshi Tomochika, Kyoto, JP;
Rohm Co. Ltd., Kyoto, JP;
Abstract
A semiconductor device which comprises a first lead having a tip formed with an island, a semiconductor chip unit mounted on the island of the first lead by means of a solder layer and having a plurality of electrode bumps projecting away from the island, and a plurality of additional leads each of which has a tip electrically connected to the electrode bumps via respective solder deposits. The additional leads include at least second and third leads. The tips of the second and third leads are at least partially wider than the semiconductor chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile