The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 1998
Filed:
Sep. 13, 1996
Applicant:
Inventors:
Yong Kwon Kim, Chungcheongbuk-do, KR;
Chang Reol Kim, Chungcheongbuk-do, KR;
Assignee:
LG Semicon Co., Ltd., Chungcheongbuk-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
438633 ; 438626 ; 438637 ; 438700 ; 438692 ;
Abstract
A method of forming a metal line structure for use with a semiconductor device includes the steps of: preparing a semiconductor substrate; forming a first line on the semiconductor substrate; forming a plug pattern on the first line; forming at least one insulating layer on an exposed surface of the first line and on the plug pattern; planarizing the insulating layer and, simultaneously, removing the plug pattern to form a contact hole which exposes at least a portion of the first line; and forming a second line in the contact hole such that the second line is configured to couple with the first line.