The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 1998
Filed:
Aug. 13, 1996
Applicant:
Inventors:
Akemi Kawaguchi, Osaka, JP;
Nobuo Aoi, Hyogo, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N / ; H01L / ;
U.S. Cl.
CPC ...
205791 ; 204404 ; 204434 ; 2057755 ; 2057905 ; 2057915 ; 438 14 ; 438 17 ; 438584 ;
Abstract
Metal formed on a semiconductor wafer is brought into contact with ions adapted to corrode the metal, and subjected to constant-current electrolysis using a galvanostat. The electrode potential of the metal is measured. There are obtained (i) the relationship between current value and time of pitting corrosion and (ii) the critical current value, based on which the metal is evaluated for surface smoothness, the pitting corrosion resistance of metal surface, resistance to pitting corrosion, the segregation amount and concentration of trace metal contained in the metal, and the grain size or grain boundary length of the metal.