The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 1998
Filed:
Apr. 19, 1995
Applicant:
Inventors:
Masatake Akaike, Atsugi, JP;
Takayuki Yagi, Machida, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C05C / ;
U.S. Cl.
CPC ...
65 36 ; 65 40 ; 65 591 ; 65 594 ; 1562722 ; 1562739 ;
Abstract
A process for anodic bonding, in which Si substrate and glass substrate are contacting each other, a voltage is applied therebetween, and then light is irradiated on a contact portion thereof, whereby the Si substrate and the glass substrate are bonded at a lower temperature than transition temperature of the glass substrate.
Akaike, Masatake. (1998). Anodic bonding process (U.S. Patent No. 5820648). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5820648
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