The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 1998

Filed:

Apr. 25, 1997
Applicant:
Inventors:

Samuel M Baker, Carleton Place, CA;

Marc P Despault, Ottawa, CA;

James D Harrison, Kanata, CA;

Assignee:

JWI Ltd., Kanata, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D21F / ; D03D / ;
U.S. Cl.
CPC ...
1393 / ; 442203 ; 162902 ; 1393 / ;
Abstract

A flat woven, pin seamed, papermakers' fabric, comprising primary warp monofilament yarns, primary weft monofilament yarns and secondary weft monofilament yarns located between and adjacent to the primary weft yarns. The secondary weft yarns are located beneath, and in contact with, the primary warp. The thickness and width of the secondary weft yarns are chosen at the weaving stage so as to control finished fabric air permeability and increase the paper side surface contact area. The fabrics are of a lower caliper, and provide increased cross direction stiffness at lower yarn counts. Formation of the pintle receiving loop yarns in a low marking woven back pin seam, or of a streamline seam, is also facilitated, without compromising fabric properties, by selection of the appropriate dimensions of the secondary weft yarns. The fabrics are woven using either round or flattened primary warp yarns, and either round or flattened monofilament primary weft yarns, or a combination thereof, according to any weave pattern which provides for floats of the primary warp yarns that extend over two or more adjacent primary weft.


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