The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 1998
Filed:
Jul. 31, 1996
Elwyn Wakefield, Bristol, GB;
SGS-Thomson Microelectronics, Ltd., Bristol, GB;
Abstract
The present invention proposes a method of manufacturing a ball grid array printed circuit board (210) that comprises the following steps: fabricating a printed circuit board, PCB, that comprises a matrix of ball grid array PCBs, each ball grid array PCB of the matrix is separated from its neighbors by the width of an electroplating tie bar (230); stamping the matrix of ball grid array PCBs for separating them and for forming an aperture (320) that is substantially centralized within each of them; preparing a metal sheet (510), onto which a semiconductor device (130) is mechanically attached; mechanically attaching a singularized ball grid array PCB to the metal sheet; and molding about the semiconductor device and a portion of the ball grid array PCB a protective material (140) that is substantially planar with respect to the ball grid array PCB.