The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 1998
Filed:
Sep. 30, 1996
Hirofumi Murakami, Kanagawa, JP;
Kazuhiko Sakai, Kanagawa, JP;
Akihiro Katagiri, Kanagawa, JP;
Yoshio Kitawaki, Chiba, JP;
Takashi Nakayama, Kanagawa, JP;
Kazuo Ito, Tokyo, JP;
Atushi Takeuchi, Saitama, JP;
Minoru Makuta, Saitama, JP;
Hitoshi Ohgane, Saitama, JP;
Kenji Hamabe, Saitama, JP;
Osamu Aoki, Saitama, JP;
Japan Polyolefins Co., Ltd., Tokyo, JP;
Honda Giken Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
A multilayer resin molding, utilizing coated resin moldings, composed of a core material and a surface layer covering the core material, the core material being composed of a resin composition which comprises 100 parts by weight of a crushed material of coated polyolefin resin moldings compounded with from 3 to 15 parts by weight of an ethylene polymer having a weight average molecular weight of from 50,000 to 180,000 and the surface layer comprising a polypropylene resin composition comprising from 30 to 80% by weight of a propylene polymer, from 3 to 20% by weight of a propylene polymer modified with an unsaturated hydroxy compound, from 15 to 40% by weight of a thermoplastic elastomer, and from 0.1 to 10% by weight of an oligomer having a functional group at the terminal thereof.