The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 1998
Filed:
Jan. 03, 1996
Applicant:
Inventor:
Naohiko Hirano, Kawasaki, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257778 ; 257691 ; 257737 ; 257773 ; 257786 ;
Abstract
A plurality of bumps formed of low melting metal are disposed on the surface of the peripheral portion of a semiconductor substrate. Those bumps which are included in the above bumps and formed on each corner portion of the semiconductor chip are connected to a power supply wiring and a ground wiring used as a power supply wiring. The other bumps disposed in position other than the corner portions are connected to a signal wiring.