The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 1998
Filed:
Nov. 20, 1996
Tomofune Tani, Tokyo, JP;
Nippon Steel Corporation, Tokyo, JP;
Abstract
A semiconductor device having a conductor film for inhibiting intrusion of moisture, mobile ions, etc. into a semiconductor chip from its peripheral edge, formed in a contact trench formed in an inter-layer insulating film. The conductor film divides the inter-layer insulating film into a peripheral edge side and an internal side and is moreover connected electrically to a semiconductor substrate. Therefore, any moisture or mobile ions entering the inter-layer insulating film from the peripheral edge of the semiconductor chip are electrically caught or expelled and cannot enter the semiconductor chip. Further, because the conductor film is formed inside the contact trench, the conductor film does not peel from the semiconductor chip even when any influences of the moisture or the mobile ions caught exist. An internal conductor can be insulated from outside by providing a protective film for covering the upper and said surfaces of the semiconductor chip.