The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 1998
Filed:
May. 31, 1996
Applicant:
Inventor:
Shigeo Oshima, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257210 ; 257386 ; 257396 ; 257503 ; 257508 ;
Abstract
In a semiconductor integrated circuit, the wiring capacitance of the bus line region is reduced, so that the operation speed can be increased, the power consumption can be decreased, and the chip size can be reduced. On the upper surface of the field oxide film (4) formed on the semiconductor substrate (8), a non-conductive insulating oxide film (12) is formed by oxidizing the poly silicon layer (9). Further, the bus lines (3A) are formed on the oxide film (12) via the interlayer insulating film (6). Therefore, a distance between the bus lines (3A) and the substrate (8) can be increased to decrease the capacitance of the bus lines (3A).