The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 1998

Filed:

Sep. 09, 1996
Applicant:
Inventors:

Shu-Yau Wu, Artesia, CA (US);

Donald L Edberg, Irvine, CA (US);

Andrew S Bicos, Huntington Beach, CA (US);

Assignee:

McDonnell Douglas Corporation, Huntington Beach, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N / ;
U.S. Cl.
CPC ...
73588 ; 73602 ; 73768 ; 356 32 ; 356 35 ; 356 355 ;
Abstract

In a system for in-situ delamination detection in composites, the invention employs a system which evaluates the mechanical vibration response of composite material structures. The damping characteristics of the composite structure are extracted from the detected wave properties generated by imbedded piezoelectric ceramic actuators and received by imbedded high strain sensitive fiber optic sensors. Such a sensor system is simple to operate for real-time non-destructive strain and displacement monitoring and delamination detection, without the need to remove the tested surface from operation. During the routine structural integrity monitoring operation, mechanical vibration pulses are launched into the composite from one actuator. The strain signal's propagation patterns are measured in real time by the fiber-optic sensors at different grating locations. Different travel times are computed dependent on the location of the receiving gratings. Propagation of the waves through a delaminated area results in wave modal properties (damping characteristics) which show a difference from those propagating through the delamination-free area. Successive signals from different locations permit computation of the location of the delamination defect.


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