The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 1998

Filed:

Oct. 18, 1996
Applicant:
Inventors:

Chiharu Miyaake, Osaka, JP;

Toshihiko Sugimoto, Osaka, JP;

Yousuke Miki, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; H05K / ;
U.S. Cl.
CPC ...
428209 ; 428901 ; 361749 ; 361750 ;
Abstract

A raw material plastic film like a band stretched in two directions with a machine direction as a longitudinal direction of stretch and a transverse direction as a lateral direction of stretch is prepared. One standard line parallel with the machine direction of stretch is assumed on a film face of the raw material plastic film. An area due to cut a cover layer plastic film and an area due to cut a base layer plastic film (the two areas are of almost the same shape) are assumed to be on the standard line in a state in which the areas are aligned in orientation. However, both an arbitrary point of the area due to cut and the point of the area due to cut corresponding thereto need to be on the standard line. A cover layer plastic film and a base layer plastic film are cut out from the two areas due to cut. Metal electric circuit is formed on a surface of the base layer plastic film via an adhesive layer. The metal electric circuit has a plastic deformation component of 0.0003 (mm/mm) or more when a stress load is imposed until strain becomes 0.002 (mm/mm), and then removed. The cover layer plastic film is stuck on the metal electric circuit via an adhesive layer with the rear face of the plastic film facing the surface of the base layer plastic film, thereby manufacturing a flexible printed circuit.


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