The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 1998

Filed:

May. 14, 1996
Applicant:
Inventors:

Tetsuo Mizuniwa, Tokyo, JP;

Yoshimi Shiramizu, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23G / ; B08B / ;
U.S. Cl.
CPC ...
134-12 ; 134-3 ; 134 41 ;
Abstract

A method for removing metallic and organic contaminations from a surface of a semiconductor wafer comprises cleaning the semiconductor wafer with a cleaning solution which contains a chlorine compound acting as an oxidant and which has a pH value in the range of 1 to 3. The cleaning solution has an oxidation-reduction potential in the range of 800 mV to 1200 mV when measured on the basis of a saturated calomel electrode at a temperature 25.degree. C.


Find Patent Forward Citations

Mizuniwa, Tetsuo. (1998). Method for cleaning a semiconductor wafer with an improved cleaning (U.S. Patent No. 5814157). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5814157

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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