The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 1998

Filed:

Jun. 24, 1996
Applicant:
Inventor:

Whu-Ming Young, Palo Alto, CA (US);

Assignee:

National Semiconductor Corporation, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F / ;
U.S. Cl.
CPC ...
364491 ; 364488 ; 364489 ; 364490 ;
Abstract

A technique for configuring multiple datapath components into a one-dimensional datapath sequence to form a datapath module that provides a specified function entails counting the number of instances in which a datapath line non-redundantly passes a datapath component in each of a plurality of different one-dimensional configurations of the datapath components for which ports of the datapath components and, as necessary, the datapath module are interconnected through datapath lines to provide the specified function. The datapath components are then placed in a particular one of the one-dimensional configurations for which the number of instances counted during the counting operation is a minimum, subject to any timing constraint. Before performing the counting and placing operations, a special procedure is preferably employed to reduce the number of configurations considered during the counting operation. The special procedure entails determining whether there is any datapath component having a single input port and a single output port. If so, an appropriate interconnection of each such single-input/single-output datapath component to another datapath component is established to form a larger datapath component, thereby reducing the number of non-interconnected datapath components. The present technique can be implemented manually and/or with apparatus such as a computer.


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