The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 1998
Filed:
Aug. 12, 1997
Sony Corporation, Tokyo, JP;
Abstract
An apparatus for correcting an orientation and a geometry of a front surface of a semiconductor wafer and holding the wafer in a state in which the adjusted surface state is kept. The apparatus has a chuck for holding a wafer; a surface measuring means for measuring a state of a front surface of the wafer; a surface adjusting means including a plurality of surface correcting portions vertically movable for partially deforming the holding portion, whereby the surface of the holding portion is deformed by independent actions of the surface correcting portions; and a tilting portion as an orientation adjusting means for adjusting a tilting angle of the front surface of the wafer with respect to the center axis thereof and an orientation of the tilting. The tilting angle of the front surface of the wafer with respect to the center axis thereof and the orientation of the tilting, and further the geometry of the front surface of the wafer are corrected by a manner of measuring them by the surface measuring means, and controlling them on the basis of the measured results by both the orientation adjusting means and the surface adjusting means.