The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 1998
Filed:
Feb. 10, 1997
Nguyen Duc Bui, San Jose, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
Interconnect via structures in a semiconductor integrated circuit having low resistance. The interconnect via structures connect metal layer structures in the semiconductor device and extend down at least one side of the metal layer structures. The interconnect via structures can extend down a second side of the metal layer structures and can extend down the end of the metal layer structures. The interconnect via structures extend beyond the sides and the end of the metal layer structures by a distance u where u is 1/4 to 1/2 F, where F is a feature of the design rule being used to manufacture the semiconductor device.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile