The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 1998

Filed:

Jun. 30, 1997
Applicant:
Inventors:

Dick J Chang, Los Angeles, CA (US);

James P Nokes, Torrance, CA (US);

Francis Hai, Torrance, CA (US);

Assignee:

The Aerospace Corporation, El Segundo, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N / ;
U.S. Cl.
CPC ...
73819 ; 73768 ;
Abstract

A thin film stress sensor measures the maximum compressive stress between two elements that are compressed together. The sensor is formed from a thin RTV film impregnated with microballoons and reinforced with carbon fibers to restrain the lateral deformation of the RTV so that more uniform pressure can be exerted on the microballoons when the sensors are uniaxially compressed. The testing method includes applying a compressive stress up to an maximum compressive stress to rupture a first portion of the microballoons, and then applying an interrogating pressure causing acoustic emissions emitted by a second portion of the microballoons when the interrogating pressure equals the equivalent maximum compressive stress, so as to determine the maximum compressive stress.


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