The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 1998

Filed:

Sep. 01, 1995
Applicant:
Inventors:

Cheol-Ha Lee, Suwon, KR;

Myung-Ho Bae, Suwon, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C / ; G01R / ;
U.S. Cl.
CPC ...
371 211 ; 371 221 ; 370241 ;
Abstract

A semiconductor integrated device is disclosed which is capable of selectively executing a memory test and a logic test. The device includes a logic part for realizing a plurality of operation functions in logic, a memory part having a given integration and for storing data, a pad part including a pad for inputting/outputting a control signal according to respective tests, a switch part respectively connected to the logic part, the memory part, and the pad part, and a switch control part for controlling the switch part to thereby selectively control the memory test and the logic test. The semiconductor integrated device according to the present invention is capable of performing a separate logic test by dividing a memory fault and a logic fault on a memory testing path. The semiconductor integrated device has a memory signal path, a logic signal path, and a pad path which are selectively used. In this manner, the semiconductor integrated device enables division of a normal mode and a test mode, and also is capable of selectively testing a logic part and a memory part to thereby improve a quality of a chip embedding a memory. Furthermore, the semiconductor integrated device is capable of improving packaging efficiency without using a separate pin associated with memory control and data input/output.


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